Axial Leaded Glass Encapsulated NTC Thermistor for Temperature Sensing, Measurement, Detection, Indicator, Monitoring, Gauging, Control, and Compensation.
AMF58 series NTC thermistor in glass encapsulated package,diode outline, with axial tinned Dumet ( Copper-Clad Ni-Fe) wire. Widely applied in temperature measurement, detection, indicator, monitoring, gauging, control, calibration and compensation, etc.
Operation up to 300C with excellent stability.
Glass body provides hermetic seal & voltage insulation, can operate in high temperature and moisture environment.
Small dimension, solid, convenient for automatic installation.
Fast heat induction, high sensitivity.
Nominal resistance @25C can be from 2kΩ— 1.388 million ohm.
Typical resistance at 25C 5k ohm, 10k ohm, 20k ohm, 47k ohm, 50k ohm, 100k ohm, 200k ohm, 500k ohm, 1.388 million ohm etc.
Tight tolerance on resistance and beta value.
In household electronics temperature measurement, detection and control: such as air-conditioners, micro-wave ovens, electric fans, and electric heaters, electric cookers, induction cooker, hair driers, etc.
Temperature detection and compensation of automatic office equipment, such as copiers and printers.
In heating and air conditioning (HVAC): in heating cost distributors, for room temperature monitoring, in under-flooring heating and gas boilers, for determining exhaust gas or burner temperature, outdoor temperature sensor.
Industrial electronics: for temperature stabilization of laser diodes and photo-elements, for temperature compensation in copper coils or reference point compensation of thermo-elements, etc. Also for temperature measurement and compensation of meters, instruments, integrated circuits, quartz crystal oscillators and thermocouples.
In telecommunication: for temperature measurement, compensation and control and protection of mobile phones, battery pack and battery charger, etc.
Glass encapsulated package NTC thermistor can also be used in temperature measurement, monitoring, detection and control of medical equipment, food processing equipment, climate, etc.
Part number | Resistance @ 25C R25 |
Beta value (K) |
Dissipation coefficient (mW/℃) | Thermal time constant (S) | Operating temperature (Centigrade) | Rated Power (mW) |
|
Resistance (K ohm) |
Tolerance (%) |
||||||
AMF58-502□3470 | 5K ohm |
±1% ±2% ±3% ±5% |
3470K |
≥2.0 in still air |
≤10s in still air |
-45~+250C | ≤50 (mW) |
AMF58-103□3380 | 10K ohm | 3380K | |||||
AMF58-103□3950 | 10K ohm | 3950K | |||||
AMF58-203□3950 | 20K ohm | 3950K | |||||
AMF58-303□3950 | 30K ohm | 3950K | |||||
AMF58-473□3950 | 47k ohm | 3950K | |||||
AMF58-503□3950 | 50K ohm | 3950K | |||||
AMF58-98.63k□4016 | 98.63KΩ | 4016K | -30~+300C | ||||
AMF58-104□3950 | 100K ohm | 3950K | |||||
AMF58-104□3990 | 100K ohm | 3990K | |||||
AMF58-104□4016 | 100K ohm | 4016K | |||||
AMF58-204□3899 | 200K ohm | 3899K | |||||
AMF58-204□4200 | 200K ohm | 4200K | |||||
AMF58-504□4250 | 500K ohm | 4250K | |||||
AMF58-1.388M□4500 | 1388K ohm | 4500K | |||||
AMF58-3.78M□4700 | 3780K ohm | 4700K |
Notes:□ in the part number for filling in resistance tolerance.
Beta value is calculated at temperature 25C and 50C, B(25/50).
Alternative rating can be made upon customer specific requirements.
Test
|
Standard
|
Test Conditions
|
ΔR25/R25 (typical)
|
Remarks
|
Low temeprature storage | IEC 60068-2-1 | Storage at low category temperature: -30 oC, Time: 1000hours |
≤2%
|
No visible damage |
Storage in dry heat | IEC 60068-2-2 | Storage at upper category temperature: 200 oC, Time: 1000hours |
≤2%
|
No visible damage |
Storage in damp heat, steady state (Humidity test) | IEC 60068-2-3 | Temperature: 40oC, Humidity:90%-95% RH, Duration:1000 hours |
≤2%
|
No visible damage |
Temperature cycling | IEC 60068-2-14 | 1. -30C/30 minutes 2. 80C/5minutes 3. 200C/30 minutes 4. 80C/5minutes. Number of cycles: 5 Cycles |
≤2%
|
No visible damage |
Test
|
Standard
|
Test Conditions and methods
|
Requirements
|
Soldering & Solderability | IEC60068-2-20 Test Ta |
Temperature: 230±5 ℃, 2-2.5mm away from ceramic body,On: 2±0.5 Seconds. |
The terminations shall be evenly tinned |
Resistant to soldering heat | IEC60068-2-20 Test Tb |
Temperature: 260±5℃, 2-2.5mm away from ceramic body,On:10±1 Seconds. |
No visible damage, ΔR25/R25≤2% |
Lead wire tensile | IEC60068-2-21 Test U |
Test Ua: Force 10N, On 10S; Test Ub: Bending 90C, Force 5N, Twice. |
No break off, ΔR25/R25≤2% |
·Minimum lead wire length tailored to shall be ≥8mm.
·In lead wire bending, bending point shall be more than 2mm away from glass body part.